The requirements of the solder filter for the automatic flip type solder machine
Our science and technology Huiyue automatic flip type solder machine: Simulation of a variety of hand motion curve, and 360 degree set arbitrary rotation angle function, soldering SMT and pin type of vertical horizontal and other products. What are the requirements for the use of the automatic flip type solder machine? The following Xiaobian tell you by Hui more detailed.
One, solder machine requirements:
1, tin furnace temperature at 400 DEG ~450 deg.
2, the concentration of flux 1:1 (adjusted according to customer requirements).
3, Pin needle flux dip (Shao Liang).
4, the foot inclined inserted depth to tin tin tin, pin needle bottom, stay out of 1~2s.
Two, solder note
1, the solder shall be uniform and smooth, no leakage welding, cold welding, joint welding, oxygen welding or tin group.
2, solder tin surface to remain clean, can not have debris. Lest debris stained pin needle cause adverse.
3, the end of the solder do not come up too fast, lest cause too much solder.
4, side welding produced when the tin tip do not affect the appearance, the best tin tip does not exist.
5, good control of flux concentration ratio, otherwise it will affect the quality of the soldering tin.
The physical map of automatic turnover type solder machine:
