Device configuration of the flip type solder machine
Dongguan Hui more technology front push type flip type solder machine is suitable for: SMT transformer and general transformer inductance, such as the use of high precision electronic parts and the use of the general need to solder the product. Below by the smaller series with the introduction of the HY-H03 before the push type flip type solder machine device configuration.
1, using the latest DSP microprocessor, NC control with high accuracy, accurate positioning
2, LCD Chinese display, easy to operate, with self check function
3, PID temperature control, furnace temperature stability
4, dual axis with the dynamic positioning speed
5, 360 degrees can be set at any angle of rotation
6, can store 99 parameters, each parameter can be set to 20 sets of steps
7, using titanium alloy solder, lead-free process in line with environmental protection
8, for the design of SMD component factory, a variety of angles to complete
9, with automatic dial tin function
10, can self define the action mode, overcome the manual solder and multi angle operation sequence problem
11, translation machinery for standard equipment
More information on the contents of the flip type solder machine is welcome to call me, Dongguan Hui more scientific and technical advice!